FREMONT, Calif., Oct. 09, 2018 (GLOBE NEWSWIRE) — Mattson Technology, a supplier of wafer fabrication equipment, has achieved a significant milestone in its growth. Shipments of Mattson’s Dry Strip, Plasma Etch and Rapid Thermal Processing equipment have now become part of volume production fabs for all top ten manufacturers of integrated circuits. The top ten chipmakers are identified based on their capital investment for wafer fab equipment reported for 2017.
“By offering equipment that meet the technical requirements of the most advanced logic and memory devices and operate in high volume production with industry leading cost of ownership, Mattson has been able to win business at all major customers,” stated Dr. Subhash Deshmukh, Mattson’s Chief Business Officer. “We have been gaining market share in sub-7nm logic, sub-20 nm DRAM as well as >64 layer 3D NAND,” continued Dr. Deshmukh.
“Mattson Technology has a long tradition in product innovation including equipment platform, plasma technology and rapid thermal anneal system designs for the best combination of technical performance and tool productivity,” commented Dr. Michael Yang, Chief Technology Officer. “By working with our customers closely, we are focusing on developing differentiated and customized solutions to address some of the new challenges in advanced semiconductor technology development and mass production.”
“We had set a strategic goal to expand our customer base to include all of the top IC manufacturers and we achieved this significant objective this year,” stated Dr. Allen Lu, President and Chief Executive Officer. “It validates the technical capabilities and cost effectiveness of our products. We look forward to continued market share growth of all our products in semiconductor manufacturers around the world.”
About Mattson Technology, Inc.
Mattson Technology, a Delaware Company, headquartered in Fremont, California, designs, manufactures, markets and supports semiconductor wafer processing equipment. Mattson’s dry strip, plasma etch, rapid thermal processing and millisecond annealing equipment are used in high volume manufacturing by leading memory and logic chip makers around the world. New innovations from Mattson in atomic surface engineering™ address the most critical 3D logic and memory manufacturing challenges. Learn more at www.mattson.com.
Mattson Technology Contact
John Arima – Assoc. V.P, Corporate Sales & Marketing
Mattson Technology, Inc.